Cooling apparatus and data center
US12120855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jun 2, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus includes a housing, a cooling air duct, and an adsorption refrigeration unit. The housing includes a plurality of sidewalls, and the plurality of sidewalls form an inner cavity. The cooling air duct passes through the inner cavity. The adsorption refrigeration unit includes an adsorption bed, a flash evaporator, and an air cooler, the flash evaporator is connected to the air cooler, both the flash evaporator and the air cooler are disposed in the inner cavity, and the air cooler is located on a path of the cooling air duct. At least one of the plurality of sidewalls is a refrigeration sidewall, the refrigeration sidewall includes an internal wall plate and an external wall plate, the internal wall plate and the external wall plate are spaced apart and form sealed space, the sealed space is connected to the flash evaporator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.