Low footprint resonator in flip chip geometry
US12120966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Sep 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.