Processing machine
US12121994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Aug 31, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processing machine includes a laser irradiation device that emits an annular laser beam, and a wire feeding device that feeds a wire from an inside of the annular laser beam. When a workpiece irradiation proportion parameter (WIP) represented by an equation WIP=Pwp/P (Pwp: laser beam power introduced onto a workpiece surface when the wire exists in an irradiation region of the laser beam, P: the laser beam power introduced onto the workpiece surface when the wire does not exist in the irradiation region) is defined, a control device controls the wire feeding device so that a wire end abuts on the workpiece surface at a beginning of additive manufacturing. The control device determines initial power P0 based on the WIP at the beginning of the additive manufacturing, and controls the laser irradiation device so that the workpiece is irradiated with the laser beam at the initial power P0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.