Methods and systems for curing composites and associated microcrack-resistant composites
US12122073B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 30, 2021 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Sep 11, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/40
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for curing a composite including a thermoset resin, a reinforcement material and a thermoplastic additive, the thermoplastic additive having a melt onset temperature, the method including heating the composite to increase a resin temperature of the thermoset resin and, during the heating, controlling the resin temperature such that the resin temperature exceeds the melt onset temperature prior to the thermoset resin achieving a degree of cure of 98 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.