Patent · US Active

Developer-free heat-sensitive recording material

US12122175B2 · kind B2 · utility

0Cited by

3References

15Claims

0Family size

Assignee

MITSUBISHI HITEC PAPER EUROPE GMBH · DE

Inventors

Claas Boxhammer · Herford, DE
Ilyas Kabul · Leopoldshöhe, DE
Helga Frahling · Bad Salzuflen, DE

Key dates

Filing date	Aug 18, 2021
Grant date	Oct 22, 2024
Priority date	—
Expiry date	Oct 30, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41M2205/04
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A heat-sensitive recording material having a carrier substrate and a fusible layer disposed on one side of the carrier substrate. The fusible layer comprises an amide wax having a melting point in the range from 60° C. to 180° C., an inorganic pigment, and a polymeric binder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.