Microelectronics H-frame device
US12122666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2021 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Sep 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronics H-frame device includes: a stack of two or more substrates wherein the substrate stack comprises a top substrate and a bottom substrate, wherein bonding of the top substrate to the bottom substrate creates a vertical electrical connection between the top substrate and the bottom substrate, wherein the top surface of the top substrate comprises top substrate top metallization, wherein the bottom surface of the bottom substrate comprises bottom substrate bottom metallization; mid-substrate metallization located between the top substrate and the bottom substrate; a micro-machined top cover bonded to a top side of the substrate stack; and a micro-machined bottom cover bonded to a bottom side of the substrate stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.