Plasma processing apparatus
US12125685B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Oct 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.