Deep ultraviolet LED inorganic module packaging device including double-sided microlens array
US12125955B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 8, 2021 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Jan 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for preparing a double-sided microlens array, which is used to prepare a uniform, large-area and easy-to-control microlens array on upper and lower surfaces of a sapphire glass lens. A complete laser wavefront is spatially divided into many tiny parts, and each part is focused on the focal plane by a corresponding small lens, and the light spots are overlapped to achieve uniform light in a specific area. The sapphire glass lens is applied to the deep ultraviolet LED inorganic module packaging device to reduce the total reflection loss between the deep ultraviolet LED package optical window-air interface, and focus the light passing through the lens on the focal plane, while increasing the emission of light Coupling ability, uniform light intensity of ultraviolet LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.