Substrate to place components for camera size reduction
US12126884B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Nov 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera may include a substrate for placing components. An image sensor having a light-receiving side and an opposite non-light-receiving side may be attached to a first side of the substrate to receive light from one or more lenses of the camera to capture an image. The camera may also include one or more additional components separate and distinct from the image sensor. The additional components may be placed beneath the non-light-receiving side of the image sensor. The components may be attached to a second side of the substrate opposite the first side where the image sensor is mounted at least partially inside one or more recesses, or embedded at least partially inside the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.