Protocol stack for analog communication in split architecture network for machine learning (ML) functions

US12127014B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Srinivas Yerramalli · Hyderabad, IN
• Taesang Yoo · Riverside, US
• Rajat Prakash · San Diego, US
• Junyi Li · Mount Olive, US
• Eren BALEVI · San Diego, US
• Hamed Pezeshki · San Diego, US
• Tao Luo · San Diego, US
• Xiaoxia Zhang · San Diego, US
• Aziz Gholmieh · San Diego, US

Key dates

• Filing date: Jan 25, 2022
• Grant date: Oct 22, 2024
• Expiry date: Feb 2, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04L5/0044
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

A protocol stack architecture for processing machine learning (ML) data includes a ML layer to manage ML data communication with a network device. The ML layer is coupled to multiple ML training blocks, and ML and inference blocks for multiple neural networks, and an analog data communications stack coupled to the ML layer. The analog data communications stack has an upper media access control analog (MAC-A) layer coupled to the ML layer and configured to store data for each neural network, a lower MAC-A layer coupled to the upper MAC-A layer and configured to segment and reassemble analog ML data, and an analog physical layer coupled to the lower MAC-A layer and configured to communicate analog data with the network device. The architecture includes a digital data communications stack coupled to the ML layer and the lower MAC-A layer and configured to manage digital communications with the network device.