Maintaining the shape of a circuit board
US12127334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2019 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Nov 16, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.