Multilayer printed circuit board
US12127341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Apr 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments provide a multilayer printed circuit board intended to connect electronic components, the board comprising a stack of a plurality of conductive layers, the conductive layers comprising two surface layers and one or more internal layers, the board comprising one or more counterbored holes, each counterbored hole comprising a portion with metallization opening onto one of the two surface layers and a portion without metallization opening onto the other surface layer; the multilayer printed circuit board may advantageously comprise one or more metal pads, each metal pad being joined to one of the two surface layers so as to occult the portion without metallization of a corresponding counterbored hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.