Method for transferring micro device on curved surface and apparatus for transferring micro device on curved surface
US12127349B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Sep 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0195
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for transferring a micro device on a curved surface according to an exemplary embodiment of the present invention includes: coating an adhesive layer on an external circumferential surface of a tube; providing a micro device pattern on one side of a substrate; positioning an external circumferential surface of the tube to contact the substrate and allow a length direction of the device pattern to cross a radius direction of the tube, and rotating the tube with respect to an axis-direction of the tube and simultaneously moving at least one of the tube and the substrate in a rectilinear way to transfer the micro device pattern on the substrate to the adhesive layer; and fixing the transferred micro device pattern to the adhesive layer by curing the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.