Encapsulated printed circuit board and a method of encapsulating a printed circuit board
US12127362B2 · kind B2 · utility
0Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | May 3, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to an encapsulated printed circuit board populated with a variety of components and a method of encapsulating a printed circuit board. The printed circuit board is partially encapsulated with a low pressure molded material to form at least a portion of a potting boat. The potting boat is filled with an encapsulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.