Compression mounted technology (CMT) socket retention mechanisms to board or interposer
US12127363B2 · kind B2 · utility
0Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2020 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Feb 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/523
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.