Micro-OLED display module thermal management
US12127430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2022 |
| Grant date | Oct 22, 2024 |
| Priority date | — |
| Expiry date | Feb 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.