Patent · US Active

On-substrate mechanical stress sensing and compensation

US12127480B2 · kind B2 · utility

0Cited by

15References

22Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Umidjon Nurmetov · Munich, DE
Ralf Brederlow · Poing, DE
Baher Haroun · Allen, US
Jose Antonio Vieira Formenti · Dallas, US
Michael Szelong · Sunnyvale, US
Tobias Bernhard Fritz · Seukendorf, DE

Key dates

Filing date	Jul 17, 2020
Grant date	Oct 22, 2024
Priority date	—
Expiry date	Oct 20, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10N30/802
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In described examples, a circuit includes an analog frontend arranged to generate an analog stress compensating signal in response to a to-be-compensated analog signal and a first-axis stress sensing signal. The analog frontend can comprise a first precision component (e.g., 220) arranged on a piezoelectric material and arranged to generate the to-be-compensated analog signal that is affected by a stress exerted in the piezoelectric material and a directional stress sensor arranged on the piezoelectric material and coupled to the first precision component. The directional stress sensor is arranged to generate the first-axis sensing signal in response to a longitudinal resultant of a stress exerted in the piezoelectric material. A compensating circuit is arranged to generate a compensated output signal in response to the compensating analog signal and to-be-compensated analog signal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.