Cutting device
US12127512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2023 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Mar 24, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26B15/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting device includes a first cutting element, a second cutting element, a first gripping element, a second gripping element, at least one driving element, a sensor, and a control unit. The cutting elements are configured to move relative to each other. The gripping elements are configured to move relative to each other. The at least one driving element is configured to move the first cutting element relative to the second cutting element when the at least one driving element is activated. The sensor is mounted on the first gripping element or the second gripping element and is configured to detect an object located between the first gripping element and the second gripping element. The control unit is operably connected to the at least one driving element and the sensor. The control unit is configured to deactivate the at least one driving element when the sensor detects the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.