System and method for integration of biological chips
US12128377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2019 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Jan 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83951
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus (100) including multiple biological chips (110,120) includes a substrate (101), a first adhesive layer (134) disposed on the substrate (101), a first biological chip (110) and a second biological chip (120) disposed on the first adhesive layer (134) and attached to the substrate (101) by the adhesive layer (134). The apparatus (100) further includes a filler (130) disposed between the first biological chip (110) and the second biological chip (120). The filler (130) includes a second adhesive layer (135) extending between a side surface (114) of the first biological chip (110) and a side surface (124) of the second biological chip (120), the second adhesive layer (135) attaching the first biological chip (110) to the second biological chip (120). The filler (130) also includes a surface layer (132) disposed over the second adhesive layer (135). The surface layer (132) has a hydrophobic surface that is co-planar with a top surface (111) of the first biological chip (110) and a top surface (121) of the second biological chip (120).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.