Polishing head, chemical-mechanical polishing system and method for polishing substrate
US12128522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2022 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Dec 29, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method includes supplying slurry onto a polishing pad; holding a wafer against the polishing pad with a piezoelectric layer interposed vertically between a pressure unit and the wafer; exerting a force on the piezoelectric layer using the pressure unit to make the piezoelectric layer directly press the wafer; generating, using the piezoelectric layer, a first voltage corresponding to a first portion of the wafer and a second voltage corresponding to a second portion of the wafer; tuning the force exerted on the piezoelectric layer according to the first voltage and the second voltage; and polishing, using the polishing pad, the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.