Vacuum deposition facility and method for coating a substrate with transverse repartition chamber
US12129542B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Aug 3, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/243
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vacuum deposition facility 1 for continuously depositing, on a running substrate S, coatings formed from metal or metal alloy, the facility including an evaporation crucible 4 suited to supply metal or metal alloy vapor and including an evaporation pipe 7, a deposition chamber 2 suited to have the substrate S run through along a given path P and a vapor jet coater 3 linking the evaporation pipe to the deposition chamber, wherein the vapor jet coater further includes a repartition chamber 31 including at least one reheater 33 positioned within the repartition chamber and a vapor outlet orifice 32 including a base opening linking the vapor outlet orifice to the repartition chamber, a top opening through which the vapor can exit in the deposition chamber and two sides converging toward each other in the direction of the top opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.