Patent · US Active

Plasma-enhanced chemical vapor deposition coating system

US12129549B2 · kind B2 · utility

0Cited by

2References

13Claims

0Family size

Inventors

Benjamin L. Lawrence · Elkhart, US
Daniel John Verdell Pulsipher · Austin, US
Ludmil Zambov · Midland, US
Pravin Chaubey · Morrisville, US
John Winterroth · Apex, US
Attila Nagy · Fishers, US

Key dates

Filing date	Feb 28, 2022
Grant date	Oct 29, 2024
Priority date	—
Expiry date	Apr 16, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68771
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A plasma-enhanced chemical vapor deposition coating system includes a deposition chamber including one or more zones of processing, an electrode centrally located within the deposition chamber, wherein the electrode forms a central axis in the deposition chamber, and a carousel configured to carry at least one substrate. The carousel is configured to move axially in a direction along the central axis from a first end of the deposition chamber to a second end of the deposition chamber. The carousel is further configured to rotate around the central axis such that the substrate is oriented in a plurality of different directions relative to the central axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.