Multi-layer ceramic electronic component, and circuit board
US12131870B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2023 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and an external electrode including: a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.