Dynamic dispatching method for semiconductor manufacturing system

US12131928B2 · kind B2 · utility

Assignee

• TONGJI UNIVERSITY · CN

Inventors

• Li Li · Beijing, CN
• Kuo-Yi Lin · Shanghai, CN
• Jie Chen · Hefei, CN
• Yiguang Hong · Durham, US
• Qingyun Yu · Shanghai, CN
• Peng Fei Yi · Shanghai, CN
• Jinlong Lei · Shanghai, CN
• Xiouxian Li · Shanghai, CN
• Min Meng · Wuxi, CN

Key dates

• Filing date: Mar 31, 2022
• Grant date: Oct 29, 2024
• Expiry date: May 17, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G05B2219/45031
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A dynamic dispatching method for semiconductor manufacturing system relates to a dynamic dispatching rule based on self-organization for dispatching in a semiconductor manufacturing system, including S1: setting roles and parameters of self-organization units, and defining key nodes in a production environment; S2: constructing a negotiation mechanism between the self-organization units, and designing a decision-making and dispatching subject ESOU; S3: according to a decision instruction of the ESOU, designing a LSOU allocation dispatching unit for distinguishing single-batch processing and multi-batch processing; and S4: designing a dispatching mechanism based on the self-organization units to implement dynamic semiconductor dispatching. The dynamic dispatching method includes three aspects: role definitions of self-organization units, a negotiation mechanism between the self-organization units and a decision-making method thereof. The simulation based on a real industry benchmark production line shows that the method improves the work movement, throughput and on-time delivery rate by 4.9%, 9.06% and 20.23%.