Biometric sensor module for a smart card and method for manufacturing such a module
US12131987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Aug 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.