Semiconductor device, imaging device, and method of manufacturing semiconductor device
US12132061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2020 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | May 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/053
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improvement in heat radiation efficiency is achieved.A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.