Semiconductor package and method for manufacturing semiconductor package
US12132063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2020 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | May 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/199
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electromagnetic noise is inhibited in a semiconductor package provided with rewiring.The semiconductor package includes a semiconductor integrated circuit, wiring, and a ferromagnetic material. In addition, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the wiring connects the semiconductor integrated circuit to a predetermined external terminal. Further, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the ferromagnetic material is provided between the wiring and the semiconductor integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.