Light emitting diode (LED) package and illuminating device including the same
US12132159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2022 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Apr 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.