Reduced light reflection package
US12133049B2 · kind B2 · utility
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2References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 22, 2023 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.