Photosensitive assembly, camera module and electronic device
US12133364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2022 |
| Grant date | Oct 29, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a photosensitive assembly, a camera module, and an electronic device. The electronic device includes an electronic device body and a camera module mounted on the electronic device body. The camera module includes a lens and a photosensitive assembly. The photosensitive assembly includes a circuit board, a photosensitive element, a base, and an adhesive. The circuit board is provided with an accommodation cavity that extends through the circuit board. The photosensitive element is accommodated in the accommodation cavity and electrically connected to the circuit board. The base is disposed on the circuit board. The lens is located in the photosensitive path of the photosensitive element. The adhesive includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located in the accommodation cavity. The second adhesive portion is located outside the accommodation cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.