Microfluidic chip and fabrication method

US12134097B2 · kind B2 · utility

Assignee

• Shanghai Tianma Micro-electronics Co., Ltd. · CN

Inventors

• Wei Li · Shanghai, CN
• Baiquan Lin · Shanghai, CN
• Kaidi ZHANG · Shanghai, CN
• Yunfei Bai · Fremont, US
• Ping SU · Shanghai, CN
• Kerui Xi · Shanghai, CN
• Zhenyu JIA · Shanghai, CN

Key dates

• Filing date: Mar 2, 2022
• Grant date: Nov 5, 2024
• Expiry date: Sep 2, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/053
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.