Adhesive assembly method and an adhesive assembly obtained by the method
US12134258B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Apr 5, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of adhesively bonding a first substrate on a second substrate in an adhesive bonding zone by an adhesive joint integrating a support mesh, wherein surplus adhesive joint is folded over onto one or the other of the first or second substrates so that the support mesh is present over the entire adhesively bonded zone after curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.