Thermosetting adhesive and adhesive sheet
US12134714B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Feb 4, 2020 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Aug 10, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.