Dual-pattern optical 3D dimensioning
US12135203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2022 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Aug 16, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An optical dimensioning system includes one or more light emitting assemblies configured to project one or more predetermined patterns on an object; an imaging assembly configured to sense light scattered and/or reflected off the object, and to capture an image of the object while the patterns are projected; and a processing assembly configured to analyze the image of the object to determine one or more dimension parameters of the object. The light emitting assembly may include a single piece optical component configured for producing a first pattern and second pattern. The patterns may be distinguishable based on directional filtering, feature detection, feature shift detection, or the like. A method for optical dimensioning includes illuminating an object with at least two detectable patterns; and calculating dimensions of the object by analyzing pattern separate of the elements comprising the projected patterns. One or more pattern generators may produce the patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.