Thermoplastic mounting medium and a method of its manufacture
US12135264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Dec 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2001/366
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermoplastic mounting medium (25) configured for embedding and subsequently fixating a sample material (10) in a moulding cavity (11) by means of sintering or melting the thermoplastic mounting medium (25) to become a monolithic bulk material at least partially accommodating said sample material (10) The thermoplastic mounting medium (25) includes a mixture of: polymer mixed with organic fibres, and thermally conductive filler having a thermal conductivity of minimum 5 W/(m×K) wherein the thermally conductive filler is mixed homogeneously with the composite material and wherein that the thermally conductive filler represents at least 30% w. of the thermoplastic mounting medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.