Semiconductor package having an interposer in which one or more dies are formed and method of forming the same
US12136597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Dec 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a first die structure, a first redistribution structure that is disposed on the first die structure, a second die structure that is disposed on the first redistribution structure, and a second redistribution structure that is disposed on the second die structure. The first die structure includes an interposer, and the interposer includes a semiconductor substrate and through-vias that penetrate through the semiconductor substrate. A first integrated circuit die is disposed in the semiconductor substrate of the interposer. The second die structure includes a second integrated circuit die that is encapsulated in an encapsulant and several conductive pillars that penetrate through the encapsulant. The first integrated circuit die is electrically connected to the second integrated circuit die through the first redistribution structure, the conductive pillars, and the second redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.