High-frequency circuit and radio device
US12136764B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 6, 2023 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/46
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency circuit includes: a first ground layer having an electric conductor formed therein; a second ground layer having an electric conductor formed therein; and a conductive pattern layer having a first conductive pattern formed thereon. The first ground layer, the second ground layer, and the conductive pattern layer are laminated one on another. The conductive pattern layer includes a first area in which a distance to the electric conductor formed in the second ground layer is longer than a distance to the electric conductor formed in the first ground layer, in a lamination direction in which the first ground layer, the second ground layer, and the conductive pattern layer are laminated. At least a part of the first conductive pattern is disposed in the first area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.