Encapsulable antenna unit
US12136769B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Feb 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna unit for transmitting and receiving high frequency signals includes a substrate that is optionally encapsulable with a potting compound having a defined dielectric value. Arranged on the substrate are two planar antennas each tuned for the high frequency signal. The planar antennas are designed such that the values of the real parts of the impedances of the planar antennas differ by the square root of the dielectric value of the potting compound. By providing two antennas, wherein one thereof is impedance-matched to a possible potting compound encapsulation, the antenna unit is able to function independently of a possible potting compound encapsulation. Electronic modules which comprise the antenna unit for wireless communication can be implemented according to the platform principle in devices that require a potting compound encapsulation and also in devices that are not encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.