Components of an electronic device and methods for their assembly
US12137529B2 · kind B2 · utility
0Cited by
53References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2023 |
| Grant date | Nov 5, 2024 |
| Priority date | — |
| Expiry date | Mar 14, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/30952
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.