Headboard assembly for modular bed frame
US12137808B2 · kind B2 · utility
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10References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Oct 17, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B12/56
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
A headboard assembly for a modular bed frame assembly includes a bracket and a headboard. The bracket includes an upper attachment structure and a lower attachment structure. The headboard is removably coupled to the bracket at the upper attachment structure. The bracket is configured to be removably coupled between two laterally adjacent planar members of the modular bed frame assembly by the lower attachment structure. At least one of the upper attachment structure or the lower attachment structure of the bracket defines a generally C-shaped section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.