Substrate processing method and substrate processing apparatus
US12138666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/0264
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes a chemical liquid nozzle 31 that includes a chemical liquid discharge port 95 discharging a chemical liquid in a chemical liquid discharge direction D1, inclined with respect to an upper surface of a substrate W, toward a target position P1 within the upper surface of the substrate W, a spray shield 101 that includes a shield surface 104 directly opposing the upper surface of the substrate W and with which the shield surface 104 overlaps with the target position P1 in plan view and, when the chemical liquid nozzle 31 and the shield surface 104 are viewed from below, all portions of the chemical liquid discharge port 95 are disposed at an outer side of an outer edge of the shield surface 104 or on the outer edge of the shield surface 104, and a nozzle moving unit 38 that moves the chemical liquid nozzle 31 together with the spray shield 101.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.