Apparatus and method for hard facing a substrate
US12138703B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Sep 14, 2043 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B17/1085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to inserts for hard facing substrates, and a method for hard facing substrates. An insert according to an embodiment of the present invention may comprise a body of ultra-hard material having a welding node located on a first surface thereof and at least one wire electrically connecting the first surface to a second, opposite, surface. In use, the inserts may be temporarily connected to a substrate by applying a resistance welding electrode to the welding node, thereby causing the wires on the second surface to melt and weld the insert to the substrate. A subsequent brazing step may firmly attach the inserts to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.