Patent · US Active

Arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece

US12138707B2 · kind B2 · utility

0Cited by

11References

16Claims

0Family size

Assignee

TE Connectivity Germany GmbH · DE

Inventors

Rudi Blumenschein · Ellwangen, DE
Frank Kaehny · Bensheim, DE
Manuel Eheim · Bensheim, DE

Key dates

Filing date	Mar 15, 2022
Grant date	Nov 12, 2024
Priority date	—
Expiry date	Nov 17, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/18
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the workpiece position.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.