Method of producing print board
US12138943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2020 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Mar 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Even if a print board includes through holes that are hardly filled with material previously, the through holes can be filled with filling material appropriately. The sealing film is attached to a lower surface of the print board and the filling material is supplied from the upper surface side of the print board under a vacuum atmosphere with screen printing to fill the through holes with the filling material. Then, the film is separated from the print board and the print board is disposed on the jig plate including recesses such that the through holes correspond to the recess. Thereafter, an auxiliary filling process in which the filling material is supplied again such that the filling material protrudes from the lower surface side of the through hole is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.