Heat-dissipating substrate structure
US12140386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2022 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Apr 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.