Head-mounted electronic device
US12140770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2023 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Oct 4, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0178
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.