Package comprising metal layer configured for electromagnetic interference shield and heat dissipation
US12142577B2 · kind B2 · utility
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2References
36Claims
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Key dates
| Filing date | Mar 3, 2021 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package that includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, at least one encapsulation layer interconnect located in the encapsulation layer, and a metal layer located over the encapsulation layer. The substrate includes at least one dielectric layer and a plurality of interconnects. The encapsulation layer interconnect is coupled to the substrate. The metal layer is configured as an electromagnetic interference (EMI) shield for the package. The metal layer is located over a backside of the integrated device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.