High frequency module and communication device
US12144104B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2022 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high frequency module includes a mounting substrate, an inductor, and a plurality of electronic components. The inductor is arranged on the mounting substrate. The inductor is arranged in an inside of the mounting substrate and has a winding portion formed by winding a conductor portion a plurality of times in a thickness direction of the mounting substrate. A first ground layer is formed in a region that is on an inner side of an outer edge of the winding portion in plan view of the mounting substrate, and the first ground layer is arranged closest to the winding portion in the thickness direction of the mounting substrate among ground layers formed in the region in a plurality of ground layers. The first ground layer is overlapped with an inner region but is not overlapped with at least part of the winding portion in plan view of the mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.