Method of manufacturing printed circuit board
US12144122B2 · kind B2 · utility
1Cited by
0References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 16, 2021 |
| Grant date | Nov 12, 2024 |
| Priority date | — |
| Expiry date | Jul 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.