Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof
US12145217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2020 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Aug 20, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/045
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.